PLC is the abbreviation of Planar Lightwave Circuit, which is a planar optical waveguide. Unlike traditional Splitters, PLC Splitters are fabricated in a semiconductor process and can integrate different functional optical components onto a single chip. This is the basic process technology for integrating, modularizing and miniaturizing optoelectronic devices.
The PLC splitter chip is fabricated using a semiconductor process (lithography, etching, development, etc.). The optical waveguide array is located on the upper surface of the chip, and the shunt function is integrated on the chip, that is, the shunt is realized on one chip. In general, each node has a split ratio of 50:50. Then, the multi-channel fiber arrays of the input end and the output end are respectively coupled at both ends of the chip and the optical path of the package waveguide is performed.
Fiber Arrays are fabricated in V-grooves that utilize a special bonding process for precise fiber positioning and high reliability to meet different needs. The thermal expansion coefficient matching package design ensures that the fiber array board is stress-free, highly reliable, and has no fiber shift at high temperatures. The end face angle can be precisely ground as required. Meets Telcordia GR-1209-CORE and GR-1221-CORE standards.
Fiber arrays rely primarily on precision-scribed V-grooves for positioning. Fiber spacing is the most important inspection item. The core spacing includes two detection metrics, the lateral distance between the core and the core (called the Pitch) and the longitudinal distance between them (called Deviation). The deviation of both is generally controlled at ± 0.5μm. The distance between adjacent fiber centers is l=127um/250um, d∝2um, r=125um. As shown below: